Analysis and Study of 3D Printing Speed and Molding Room Temperature on Mechanical Properties of PCB Epoxy Resin Substrate

Abstract

Based on the technological characteristics of the 3D printing, powder material through solid melt state solid two phase transition, so printing process parameters will of molding stress distribution has a significant impact, thereby affecting the mechanical properties of the products. In particular, the 3D printing technology is applied to the manufacture of printed circuit boards (PCB), and it is needed to improve the mechanical properties of PCB by strictly controlling the warping deformation. Based on the selective laser sintering process, the paper has carried out the mechanical simulation of the FR-4 epoxy resin substrate printing process on the basis of PCB. The printing speed and the temperature of molding chamber on an FR-4 epoxy substrate equivalent stress distribution and warping effects. The results of the study show that: the maximum equivalent stress generally appears in the corners and edges model. Influence of printing speed on the equivalent stress is obvious. In the range of the actual printing speed, the maximum equivalent stress value of the printing piece shows a decreasing trend with the increasing of the printing speed and the temperature of the forming chamber, and the stress fluctuation range decreases gradually. In order to minimize the distortion of the printing piece, combining with the existing process conditions, the printing speed should be greater than 60 mm/s, the molding room temperature should not be less than 120 degrees Celsius. In this paper, the design of the related process parameters is proposed, which is helpful to improve the mechanical properties of the printing piece. Keywords—3D printing technology; process parameters; PCB epoxy resin substrate; mechanical properties