Abstract
Microelectromechanical system (MEMS) relays are gradually replacing traditional relays because they are smaller and lighter and consume less power. However, performance parameters of MEMS relays, such as the pull-down voltage, response time, and resonant frequency, often deviate from those originally designed, due to residual stress generated during the fabrication process. We present herein a method to measure this residual stress, based on a metal bridge membrane MEMS relay, with the help of a nanoindenter and the finite-element method (FEM). The testing result lies in a reasonable range, indicating that this simple method is reliable and helpful for MEMS relay optimization.
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