An On-Wafer Deembedding Procedure for Devices under Measurement with Error-Networks Containing Arbitrary Line Lengths

Abstract

Error networks that include contact structures and which embed devices under measurement (DUM) can often be partitioned into different line segments having constant line widths. The basic idea of the here proposed deembedding procedure is the calculation of the error network from a piece by piece characterization of the line segments. In the first step of the proposed deembedding method, the propagation constants and the characteristic impedances of the various line segments are calculated from high frequency S-parameter measurements. In the second step, the chain parameter matrix Aseg of the different line segments are then calculated. The third step consists of the calculation of the chain parameter matrix Aerror of the complete error network. Finally, one can calculate the scattering chain parameter matrix Terror from the related chain parameter matrix A'error of the complete error network. The main advantage of this method lies in the fact that only thru lines with different line lengths have to be measured. A further advantage of this deembedding procedure is that the error networks embedding different DUM's can contain line segments of arbitrary line lengths. Therefore, the proposed deembedding procedure can be used for DUM's that are embedded in error networks that consist of different line segments with constant line widths.