Abstract
An online test structure for measuring the thermal conductivity of surface micromachined polysilicon thin films is presented. In the structure, a pair of microstructures, i.e., a reference structure and a test structure, are used. The surface micromachined structures are heated electrically. Heat dissipation by convection, radiation, and heat transfer through the air gap and into the substrate is considered in an electrothermal model. The model is confirmed by ANSYS Software. In experiments, current-voltage measurements are only required, and all measurements can be carried out in free air. The surface-micromachined and p-doped polysilicon thin films with a sheet resistance 116.25 /spl Omega//sq. are measured to have a thermal conductivity 28.7 W/mK at 300 K.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
