Abstract
RF packaging is one of the most challenging topics in LTCC technology. Today LTCC is particularly capable for advanced packages and systems-in-package because of its electrical, functional, thermomechanical properties as well as its excellent long-term stability and reliability. LTCC combines the potential for miniaturization, low loss handling of high frequencies up to 110 GHz and offers the opportunity to integrate additional features. Therefore it has to go through various manufacturing steps and several refirings without any performance degradation or loss of dimensional accuracy. This paper discusses the impact of thermal post processing on RF characteristics and geometrical properties of LTCC. Ceramic substrates with radar front ends, calibration structures and other test vehicles made of Du Pont Green Tape® 943 and 9k7 were cofired following the recommended conditions and refired several times in order to investigate and compare the influence of the postfiring. The flatness, dimensions and RF performance of the ceramics up to 110 GHz were evaluated and compared.
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