Abstract
This paper presents an image inpainting method for 3D stacked image sensor. A typical structure for 3D stacked image sensor includes a pixel array, an analog-to-digital converter (ADC) array, and an image signal processor (ISP), which are connected vertically by through silicon vias (TSVs) or microbumps ( $\mu $ bumps). To improve the quality of the output images when existing one or more $\mu $ bump/TSV/ADC failures, it is proposed to interleave the connections from pixel array to ADC array and recover the inaccessible data in the ISP. The sub-array of pixels corresponding to the defective $\mu $ bump/TSV/ADC would be convenient to be inpainted. An inpainting method used for the damaged block of pixels is proposed, the image is progressively reduced through a process of the discrete wavelet transform (DWT) and down-sampling until the damaged block converts to one pixel only. The reduced image is inpainted and optimized, and then the original image size would be restored by up-sampling. Evaluations over a range of images demonstrate that the proposed method improves average peak-signal-to-noise-ratio (PSNR) by 1.93-3.25 dB compared with the exemplar-based method and the TV method in case single or multiple $\mu $ bump/TSV/ADC defects.
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