Abstract
The IC industry has been growing rapidly in the past decades. The continuous scaling-down of the feature size requires IC machines of highest performances, and pushes the IC manufacture to its utmost technology limits. Nowadays, IC manufacturers employ tightly fixed process parameters as their strategy to improve the yield. In this paper, a “softer” way is proved to be more potential in further improving and managing the yield of IC products. A novel concept which suggests running an IC procedure with dynamic process parameters is explained in detail. By using auto-regressive moving-average (ARMA) model, effects of the key process steps can be predicted and the related process parameters can be adjusted self-reactively. Since the discussion indicates distinct improvements of the IC yields, it seems the time to break the rule of “using stationary process parameters”.
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