Abstract
Intensively evaporating liquid films, moving under the friction of a co-current gas flow in a mini-channel (shear-driven liquid films), are promising for the use in cooling systems of modern semiconductor devices with high local heat release. In this work, the effect of various parameters, such as the liquid and gas flow rates and channel height, on the critical heat flux in the locally heated shear-driven water film has been studied. A record value of the critical heat flux of 1200 W/cm2 has been achieved in experiments. Heat leaks to the substrate and heat losses to the atmosphere in total do not exceed 25% for the heat flux above 400 W/cm2 . Comparison of the critical heat fluxes for the shear-driven liquid film and for flow boiling in a minichannel shows that the critical heat flux is an order of magnitude higher for the shear-driven liquid film. This confirms the prospect of using shear-driven liquid films in the modern high-efficient cooling systems.
Highlights
Development of the modern microelectronic equipment requires the effective cooling solutions because it is necessary to remove high heat fluxes of up to 1 kW/cm2 and higher from the local hot spots of the processor [1]
The behavior of the liquid film moving under the influence of gas was studied in this paper with the values of heat flux q = 0-1200 W/cm2, liquid Reynolds number Rel = 8.5-193 and superficial gas velocity Usg = 3.8-93 m/s
At a certain value of the heat flux, the film breakdown occurs with dry spot formation on the substrate
Summary
Development of the modern microelectronic equipment requires the effective cooling solutions because it is necessary to remove high heat fluxes of up to 1 kW/cm and higher from the local hot spots of the processor [1]. Thin and ultra-thin (less than 10 μm in thickness) liquid films, moving under the action of a forced gas flow in a mini-channel, are promising for the use in the temperature control systems of modern semiconductor devices [2]. The first experiments with locally heated liquid films, moving under the action of gas, showed that they are less subject to the breakdown than the liquid films moving under action of gravity. This is because the film breakdown and formation of dry spots can be controlled by the forced gas flow. Data on heat leakages into the substrate and heat losses into the atmosphere are presented here
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