Abstract
In the current numerical study, an entropy production analysis is conducted for the electroosmotic flow and convective heat transfer in the microduct. A number of blades are installed inside the system to create the swirl flow and enhance the heat and mass transfer. The results obtained by this investigation are compared with those achieved by other studies to verify the precision of the numerical procedures employed. The length, position, and number of conductive blades, and the electric field intensity are considered as the input parameters. The frictional, thermal, and diffusion types of entropy production are considered as the output parameters. The results show that the frictional entropy production increases, while the thermal entropy production decreases as more number of conductive blades is installed in the system. The amount of diffusion entropy production is very small. In addition by increasing the blade length from 15 to 35 µm, the average velocity in the system increases and accordingly, the frictional entropy production increases up to 140.3% and the thermal entropy production diminishes about 71.2%. By relocating the conductive plate from x = 500 µm to x = 2000 µm toward the outlet section of the system, the frictional entropy production is reduced about 84.4% and the thermal entropy production is boosted up to 261.1%. Increasing the external field strength causes an increase in the frictional entropy production and a decrease in the thermal entropy production.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.