An empirical survey on the influence of machining parameters on tool wear in diamond turning of large single-crystal silicon optics

Abstract

We conducted a series of screening experiments to survey the influence of machining parameters on tool wear during ductile regime diamond turning of large single-crystal silicon optics. The machining parameters under investigation were depth-of-cut, feed rate, surface cutting speed, tool radius, tool rake angle and side rake angle, and cutting fluid. Using an experimental design technique, we selected twenty-two screening experiments. For each experiment we measured tool wear by tracing the tool edge with an air bearing linear variable differential transformer before and after cutting and recording the amount of tool edge recession. Using statistical tools, we determined the significance of each cutting parameter within the parameter space investigated. We found that track length, chip size, tool rake angle and surface cutting speed significantly affect tool wear, while cutting fluid and side rake angle do not significantly affect tool wear within the ranges tested. The track length, or machining distance, is the single most influential characteristic that causes tool wear. For a fixed part area, a decrease in track length corresponds to an increase in feed rate. Less tool wear occurred on experiments with negative rake angle tools, larger chip sizes and higher surface velocities. The next step in this research is to perform more experiments in this region to develop a predictive model that can be used to select cutting parameters that minimize tool wear.