An all-glass chip-scale MEMS package with variable cavity pressure

Abstract

A dielectric, chip-scale MEMS packaging method is discussed. The packaging method uses wafer-to-wafer bonding of micromachined glass wafers with a reflowed, glass, sealing ring. The glass wafers are micromachined and have metal and silicon structures patterned on them with metal and fluidic feedthroughs. A variety of getters and sealing designs are disclosed to vary the pressure of the microcavity by many orders of magnitude from under 1 mTorr up to 1 atm (760 000 mTorr), enabling either vacuum or damped packaging of the device elements on the same chip. The final singulated, all-glass, chip-scale package can have electrical, optical/IR and fluidic interfaces. Applications for resonators, switches, optical sensors and displays are discussed.