Abstract

Hard amorphous carbon nitride (a-C:N) films fabricated by shielded arc ion plating break into pieces because of the large compressive stresses in the films when the film thicknesses are more than 200 nm. In the application of these films to practical hard coatings, the development of a technique to grow thicker films (over 1 µ m) is necessary. In this study, we developed a multistep ion plating technique to grow thick hard multilayer films. We formed a-C:N multilayers with a total thickness of more than 1 µ m on Si (100) and high speed steel (SKH9) substrates by stacking hard and soft films alternately in order to relax the large compressive stress in the hard film. The multilayers are extremely hard (Knoop hardness: 3200) and neither break into pieces nor peel off substrates spontaneously.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.