Abstract
AbstractIn GaN‐on‐silicon there are many challenges which are currently encountered when making this technology compatible with standard Si‐CMOS fabs especially the bow. Bringing this technology to CMOS fabs can potentially drive the costs down, in addition to the cost advantage expected from large wafer sizes. We report here on the impact of AlN nucleation layer on crystal quality and bow. The focus will be on V/III ratios and pre‐dose conditions for AlN, which have considerable effect on the AlN/AlGaN/GaN buffer structures. We will also discuss how AlN thickness can be used to tune the bow. Finally, a brief description on the effect of surface pits will be presented.(© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.