Abstract
Present study deals with the development of aligned multi-walled carbon nanotubes (MWCNT) and vapour grown carbon fibers (VGCF) reinforced epoxy adhesive system used as an alternative to Pb/Sn soldering element. The alignment of MWCNTs was carried out in a specific designed instrument exerting of an external electric field. Solution casting technique was used for the fabrication of epoxy adhesive system incorporated with aligned MWCNT and VGCF. Scanning electron microscopy and Atomic force microscopy was carried out to determine the degree of alignment of MWCNTs. Owing to the formation of continuous path for the flow of electrons, 3 wt% of aligned MWCNT with 3 wt% of VGCF reinforced epoxy adhesive achieved about five orders of magnitude higher in the thermal conductivity compared to pure epoxy. Further, the experimental results showed that the shear strength of epoxy/3% MWCNT/3% VGCF adhesive system was 112% higher than the strength of pure polymer, emphasizing the advantages of aligned MWCNT on stiffness and strength. Dynamic Mechanical Analysis and Thermo-gravimetric analysis was carried out to study the thermo-mechanical and thermal degradation behaviour of epoxy adhesive formulations.
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