Abstract
The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50mA/〖cm〗^2 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.
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