Abstract
The process of interdiffusion in thin film Cu–Pd multilayer system was studied in the temperature range of 393–493K for different annealing times using Auger electron spectroscopy (AES) in conjunction with an argon ion sputtering. The changes in Auger depth profiles caused by heating have been converted into compositional changes of diffusing species. On the basis of the concentration distribution of Pd and Cu inside the Pd–Cu multilayer structure the interdiffusion coefficients have been obtained in the studied temperature range. Interdiffusion data have been discussed and compared with diffusion parameters obtained by using different methods.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
