Abstract
Applying surface and bulk micromachining techniques to the RF/Microwave regime has taken off over the last 10 years. RF MEMS devices offer a high-performance, low-cost solution to many RF/Microwave applications. This abstract will summarize the present state of RF MEMS passive and active components including performance and reliability data for several types of RF MEMS including switches from Raytheon, Lincoln Labs, Rockwell Scientific and Radant MEMS. In addition, packaging issues and future packaging concepts will be discussed.
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