Abstract
Machine learning has opened a new realm of possibilities in photonic circuit design and manufacturing. First, we describe our approach of using deep learning to optimize the multi-dimensional parameter space for hundreds of optical chips on a mask, resulting in homogeneity of performance in high volume applications. Second, we present our approach of using a support vector machine to predict the performance of optical devices by wafer probing. This approach eliminates the expensive and labour-intensive process of optical chip testing, and allows unprecedented control over the fabrication process, including in-situ monitoring of wafer fabrication and real-time process adjustments. The combination of these two approaches paves the way for accelerated adoption of photonics in high volume applications.
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