Abstract

With development of advanced package technology, requirements for lithographic process become tighter than before. When dealing with 200mm or 300mm wafer, stepper shows better uniformity of CD and overlay. SS B500 stepper can be used in RDL and Bump process. This paper introduces features of SS B500 stepper, such as wide band exposure lightsource, large field size, flexible alignment strategy, direct focus measurement, and proposes absolute overlay error concept and measurement mothod based on golden wafer. It also provides test data for CDU, UDoF, overlay for single machine and matching, thick photo resist performance, which shows specification of the stepper meeting well with advanced package process.

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