Abstract
The aim of present study was to investigate the adsorption properties of Cu(II) ion-imprinted poly(allylamine)-silica (IIP-PAA/SiO2) in aqueous solutions by static and dynamic methods. The results showed that copper adsorption capacity of IIP-PAA/SiO2 reduced with increasing the temperature, and ΔH 0 was negative value and elevating temperature was not helpful to adsorption. Adsorption kinetics data could be described by pseudo–second-order kinetics equation, and fitting adsorption rate constant and balanced adsorption capacity were related to initial solution concentration. Besides, IIP-PAA/SiO2 had excellent column adsorption property and reusability. Neither copper adsorption capacity nor breakthrough time decreased obviously after six dynamic adsorption–desorption cycles.
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