Abstract
Summary Activated reactive ion plating (ARIP) processes are characterized by the following features: (1) the substrate is subjected to a flux of ions before and during film formation, (2) a reactive gas is incorporated into the growing film, and (3) the evaporating material is activated because it is either the cathode or the anode of an arc discharge such as in thermionic arc evaporators, hot hollow cathode discharge evaporators or cathode spot arc evaporators. ARIP processes are used to produce well adhering, dense nitride, carbide and oxide films at relatively low substrate temperatures. They are in commercial use to produce films for both wear protection and optical applications.
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