Abstract
AbstractThe effect of elevated temperature aging on the interphase of a polyimide adhesive and a titanium substrate has been investigated. An interfacially debonding adhesive test was applied, and the adhesive/substrate interphase was characterized through an analysis of the failure surfaces. To facilitate the aging study, an “openfaced” adhesive geometry, the notched coating adhesion (NCA) test, was used. Use of this adhesive geometry allows an acceleration of diffusion‐related aging phenomena by up to two orders of magnitude, as compared to a traditional “sandwiched” bond. The failure surfaces were characterized using X‐ray photoelectron spectroscopy and optical microscopy. Bulk adhesive properties were investigated using differential scanning calorimetry and solvent uptake. Although there was evidence of polyimide degradation within the interphase, only minor changes in the bulk polyimide properties were detected. This indicates that the adhesive may be degrading preferentially in the interphase region.
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