Abstract
We will report our experience in the design and characterization of a second generation dual-in-line single chip package currently in production was designed to contain a 0.250 inch square chip and to dissipate less than 350 mW in continuous operation. The package operates in external fields up to 100 Oe and shows no irreversible changes over the range −25°C to 100°C; the overall package size is 0.8×0.8×0.35 inches and it fits a 0.9\ pitch socket. (AIP)
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