A three-dimensional eigenfunction expansion approach for singular stress field near an adhesively-bonded scarf joint interface in a rigidly-encased plate

Abstract

A three-dimensional eigenfunction expansion approach for determination of the singular stress field in the vicinity of an adhesively-bonded scarf joint interface in a plate, with its top and bottom surfaces being encased, fully or partially, between infinitely rigid blocks is presented. The plate is subjected to extension/bending (mode I) and in-plane shear/twisting (mode II) far-field loading. Both the adhesive layer and plate materials are assumed to be isotropic and elastic. The boundary conditions that are prescribed on the end-faces (free, fixed and lubricated) of the plate as well as those, prescribed at the bottom or top surface of the scarf-bonded plate on either side of the interface between the plate and adhesive layer materials (fixed-fixed, free-fixed and fixed-free), are exactly satisfied. Numerical results include the dependence of the lowest eigenvalue (or most severe stress singularity) on the wedge aperture angle of the plate material. Variation of the same with respect to the shear moduli ratio of the constituent plate and adhesive layer materials is also an important part of the present investigation. Hitherto unobserved interesting and physically meaningful conclusions in regards to the fixed edge singularity and delamination type flaw sensitivity of an adhesively bonded plate surface are also presented. Finally, hitherto unavailable results, pertaining to the through-width variations of stress intensity factors corresponding to symmetric and skew-symmetric sinusoidal loads that also satisfy the boundary conditions on the end-faces of the adhesively bonded plate, in the vicinity of the scarf joint interface, under investigation, bridge a longstanding gap in the bonded joint stress singularity/fracture mechanics literature.