Abstract
With the development of power electronics technology, power modules delivery considerably greater power density, which makes junction temperature an important parameter for reliable operation. Existing thermal models often ignore the influence of the thermal boundary conditions on the thermal parameter and cannot accurately predict junction temperature in various operating conditions. This article proposes a three-dimensional compact thermal network model that considers the thermal boundary conditions and can be obtained by the finite-element method (FEM). A novel two-step method for thermal parameter extraction is presented and the effects of boundary conditions on thermal network parameters are discussed in detail. The experimental results and FEM simulation show that the proposed thermal network model can accurately estimate the junction temperature in different thermal boundary conditions.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
