Abstract
In this study, a one-dimensional heat transfer measurement device is developed based on the mathematical theory of the Angstrom method. To conform to the mathematical assumption, it is required that the device precisely controls the heat source to generate sinusoidal temperature signal. A thermo-electric module is used as the heat source for the measurement platform. This module is connected to a computer for program control, such that the temperature can be controlled quickly, precisely, and dynamically. In this study, five common heat-conducting materials are tested to verify the proposed one-dimensional heat transfer measurement device. By substituting the experimental results into the mathematical model of the Angstrom method, the thermal diffusion and thermal conductivity of the test material is calculated. The experimental results are compared with the physical properties of the materials, and the accuracy error is extremely low. This study confirmed that the Angstrom method theory applied thermal diffusivity and thermal conductivity measurement, which can be realized by thermo-electric temperature control technology.
Highlights
With the recent advancements in technology, 3C products, including smartphones, laptops, and wearable electronic products, are becoming thinner and lighter
Based on the Angstrom method, we developed a simpler measurement device that can rapidly measure the thermal conductivity of materials [6,7]
The thermal conductivities of five common heat-conducting materials used in electronics, namely red copper, brass, silver, aluminium alloy (1050), and non-metallic aluminium nitride ceramic, are measured
Summary
With the recent advancements in technology, 3C (computer, communication, and consumer electronics) products, including smartphones, laptops, and wearable electronic products, are becoming thinner and lighter. Devices used to measure the thermal conductivity of materials include those based on the transient plane heat source method and the thermal diffusivity by the flash method. Based on the Angstrom method, we developed a simpler measurement device that can rapidly measure the thermal conductivity of materials [6,7]. A therm based on the Angstrom method, we designed an experimental device to measure the thermal conductivity of materials rapidly [8]. The obtained parameters are substituted in the mathematical model of the Angstrom method to verify the measurement results of the device
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