Abstract
When performing In-Circuit Tests (ICTs) of Printed Circuit Boards (PCBs), there are certain phenomena related with strain analysis that must be known in order to obtain stronger and more accurate testing results. During testing, PCBs are often subjected to mechanical bending efforts that induce excessive strain. This study focuses on the building of a Finite Elements Analysis (FEA) methodology that prevents excessive bending strain in critical points of a PCB during an ICT. To validate this methodology, a set of experimental tests, matched with a set of FEA, were carried out. Thus, companies, before the development of an ICT machine (fixture), will be able to use this FEA methodology to predict whether the maximum strain of a PCB under study, when subjected to its ICT, will damage it, thus reducing unnecessary production costs. A guideline was thus designed to enable the creation of the most representative Finite Elements Model (FEM) for any PCB, based on its amount and direction of copper traces.
Highlights
During the whole Printed Circuit Boards (PCBs) production process, electronic devices are subjected to several external interferences that can cause excessive bending, damaging them
Several studies related to PCB bending have been carried out, trying to predict PCB behaviour during several phases of the production process, as well as when they are subjected to external efforts in their final usage
The pressers’ locations are achieved without carrying out any previous study, based only on the expertise of the In-Circuit Tests (ICTs) fixtures designers. This expertise-based process often leads to high bending efforts that induce an excessive strain on the PCB, damaging them, and causing failure in proper operation of the PCB [1]
Summary
During the whole PCB production process, electronic devices are subjected to several external interferences that can cause excessive bending, damaging them. Several studies related to PCB bending have been carried out, trying to predict PCB behaviour during several phases of the production process, as well as when they are subjected to external efforts in their final usage. The pressers’ locations are achieved without carrying out any previous study, based only on the expertise of the ICT fixtures designers. This expertise-based process often leads to high bending efforts that induce an excessive strain on the PCB, damaging them, and causing failure in proper operation of the PCB [1]
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