Abstract
The reliability of polysilicon thin-film transistors (poly-Si TFTs) employing the dual-layered gate insulator was investigated. We suggested the use of the double gate insulator, which is composed of silicon oxide and silicon nitride , to overcome the lower gate-oxide reliability and high leakage-current problems caused by the thin gate insulator of poly-Si TFTs. The breakdown field increased to and the leakage current decreased by up to 1 order of magnitude compared with that of TFT using the single gate insulator. Experimental results showed that the reliability of poly-Si TFTs employing the gate insulator was greatly improved by the reduced charge trapping and the relatively larger thermal conductivity of the film.
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