Abstract

The authors compare the power and ground path inductance for three types of plastic packages. These packages are the 196 S/L PQFP (single-layer plastic quad flat pack), the 296 FR-PQFP (fine-pitch PQFP), and the 196 MM-PQFP (multilayer molded PQFP with one power and one ground plane). The S/L PQFP and the MM-PQFP packages are wirebonded and the FP-PQFP package is TAB (tape automated bonding) bonded. The authors also present plots of lead inductance as a function of the number of leads for the three packages and MM-PQFP plane inductance as a function of the number of leads. Simulations show that the MM-PQFP has the lowest power and ground path inductance while the S/L PQFP has the highest. >

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.