Abstract
In semiconductor manufacturing process, probe station that is testing equipment is important. Inspection step is for detecting defects on semiconductor before the packaging. Probe card is a part of probe station and contains probe tip that contacts to semiconductor. Through probe tip, it can inspect defects of semiconductor. In this paper, optimization method is used with response surface analysis to design MEMS type probe tip. And fabricating probe tip uses maskless lithography, electro-plating and lapping process.
Highlights
Semiconductor technology develops to highly integrate and compact
We fabricate probe tip using electro plating with Nickel, so properties of probe tip that we made are different from general Nickel materials
Maskless lithography system that is used for fabricating probe tip is DMD type and exposure UV light source on pattern image
Summary
Semiconductor technology develops to highly integrate and compact. Testing process for semiconductor is developed [1]. Probe station is test equipment for chips on wafer, using probe tip involved in probe card for testing [2]. Probe card can be classified into cantilever, vertical and MEMS (Micro Electro Mechanical System) types [3]. We design MEMS type probe tip using optimization method with response surface analysis and fabricate probe tip through maskless lithography, electro plating and lapping process
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