Abstract
In this paper, a simple experimental method for the transient thermal characterisation of semiconductor packages is presented. The method is based upon the assumption that in many cases, device temperature evolution can be accurately described by a few exponential terms, as will be shown to be the case when transient thermal response has widely separated time constants. The proposed method, begins with the experimental determination of transient thermal response followed by numerical extraction of the time constants and amplitudes for the significant exponential terms, and is applied to a number of commercial Smartpack ® modules in order to obtain a dynamic model that can be used in circuit and numerical simulators, in order to predict the dynamic thermal behaviour of the device under any working condition.
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