Abstract
The successful demonstration of a 1:4 power divider using microstrip probes and a WR-430 rectangular waveguide is presented. The 15-dB return loss bandwidth of the nonoptimized structure is demonstrated to be 22% and its 0.5-dB insertion loss bandwidth 26%. While realized through conventional machining, such a structure is assembled in a fashion consistent with proven millimeter and submillimeter-wave micromachining techniques. Thus, the structure presents a potential power dividing and power combining architecture, which through micromachining, may be used for applications well above 100GHz.
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