Abstract
An accurate broadband surface integral equation formulation for interconnect-type problems is obtained from the volumetric integral equation. The three-dimensional volumetric current density inside the interconnect is expressed as a product of unknown vector surface current density at the conductor boundary times the known exponential factor describing the skin-effect attenuation of the current off the conductor surface. The enforcement of known current dependence along the coordinate normal to conductor surface allows for reduction of governing volumetric integral equation formulation to the surface electric field integral equation (EFIE) superposed with an appropriate surface impedance operator. The model is implemented in conjunction with RWG method of moments discretization of resultant surface EFIE and is shown to provide accurate extraction of network parameters from dc to microwaves.
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