Abstract
We conducted a numerical analysis on a novel P-GaN gate AlGaN/GaN HFET heterostructure field effect transistor with junction field plate (JFP-HFET) in our study. A fabrication process was proposed to realize the novel JFP-HFET. According to our simulation results, the BV of JFP-HFET can be significantly improved from 600 V to 1340 V, which is nearly 120% higher than that of conventional P-GaN gate HFET. The forward characteristics showed that J KP did not strongly affect the on state resistance R on and the maximum drain current I dsmax . By optimizing the length of P-AlGaN region of the JFP L p to 5.8 μιη, the hole concentration of P-AlGaN N p to 1×1017cm 3 and the thickness of the JFP T j to 500 nm, the highest Baliga's figure of merit (BFOM) of 1.39 GW/cm2 can be achieved.
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