A New Mold Structure to Replicate Patterns Over 1 <I>μ</I>m in Depth for Substrate Conformal Imprint Lithography

Abstract

This paper shows an improved mold replication process that uses polyurethane acrylate (PUA) and polyethylene terephthalate (PET) for the fabrication of an ultraviolet (UV) imprinting mold used in substrate conformal imprint lithography (SCIL). With the conventional replication process, which uses hard polydimethylsiloxane (h-PDMS) as a pattern layer, it is difficult to detach the mold from a silicon master for metal oxide semiconductor field effect transistor (MOSFET) that has patterns with over 1-micron depth. However, the method proposed in this paper allows us to easily replicate patterns that have more than 1-micron depth. The key idea of this method is to use PET film as a bonding layer to attach the PUA layer to the polydimethylsiloxane (PDMS) cushion layer to overcome the weak the adhesion force between the PUA and PDMS layer. We demonstrate how to make the modified replica mold and present imprinting results obtained using this replica mold in the SCIL process.