Abstract
Abstract This paper describes an investigation of the possibility of using a new conductive ink, insted of copper clad laminates, in the manufacturing of microstrip patch antennas on glass and fiberglass substrates and of bioinspired frequency selective surfaces (FSSs) on fiberglass substrates for wireless communication systems. The new conductive ink is developed using synthesized nitrocellulose which, in ethyl acetate solution, works as a bonding agent and carrier for the formation of a conductive film. The load used in the fabrication process is silver metallic powder. Simulation and analysis are performed using Ansoft Designer and HFSS softwares. Microstrip antenna and FSS prototypes are fabricated and measured for comparison purpose. An agreement is observed between simulation and measurements results.
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