A new compact stripline patch filtenna module

Abstract

In this paper, a new compact stripline patch filtenna module (SLPFM) has been proposed, designed, and fully investigated using the well-known electromagnetic simulator (CST_MW simulator). The objective is to design and fabricate a movable and compact microstrip patch chip (MS-Chip) mounted on a microstrip motherboard (MS-motherboard). The main function of the MS-Chip is to operate as Flip-Chip microstrip filter-antenna module to achieve the desired applications for the microwave wireless devices. The proposed SLPFM can cover many wireless applications including GSM, WLAN, WiMAX, and LTE. A detailed parametric study has been conducted and investigated to optimize the main design parameters of the proposed SLPFM. These parameters include chip dimensions, chip dielectric constant relative to the motherboard, and the chip-to-motherboard interconnect geometry (configuration and dimensions). Simulation results showed that the design MS-Chip parameters can be used to control and adjust the filtenna passbands and stopbands to cover the desired applications. FR-4 substrate has been used to fabricate the presented stripline filtenna module (chip and motherboard). Reasonable agreement has been achieved between measured and simulated results. The presented design demonstrates the benefits of using a movable microwave MS-Chip antenna (Flip-Chip filter-antenna module). Therefore, the same MS-Motherboard of the wireless device can use different Flip-Chip filter-antenna modules to include different wireless applications.