Abstract

Sapphire is a promising material for various optical, electronic, and mechanical applications, but is very difficult to machine due to its high hardness and brittleness. In this study we attempt to study fundamental atomistic mechanisms of nano-scale cutting of sapphire using Molecular dynamics (MD). Atomistic models for diamond cutting of sapphire are developed using Vashishta and Lennard-Jones potentials and MD simulations address the effects of the tool edge radius and uncut chip thickness on the cutting process. Cutting and normal forces with different cutting parameters are calculated and compared with the experimental data in previous research. An analysis using a local measurement of atomistic strain also reveals detailed deformation mechanisms of the sapphire cutting process.

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