A microscopy approach for in situ inspection of micro-coordinate measurement machine styli for contamination

Abstract

During the process of measurement using a micro-coordinate measurement machine (µCMM) contamination gradually builds up on the surface of the stylus tip and affects the dimensional accuracy of the measurement. Regular inspection of the stylus for contamination is essential to determine the appropriate cleaning interval and prevent the dimensional error from becoming significant. However, in situ inspection of a µCMM stylus is challenging due to the size, spherical shape, material and surface properties of a typical stylus. To address this challenge, this study evaluates several non-contact measurement technologies for in situ stylus inspection and, based on those findings, proposes a cost-effective microscopy approach. The operational principle is then demonstrated by an automated prototype, coordinated directly by the CMM software MCOSMOS, with an effective threshold of detection as low as 400 nm and a large field of view and depth of field. The level of contamination on the stylus has been found to increase steadily with the number of measurement contacts made. Once excessive contamination is detected on the stylus, measurement should be stopped and a stylus cleaning procedure should be performed to avoid affecting measurement accuracy.