Abstract
This paper describes a laterally deflecting micromachined device that can be used to electronically monitor residual strain and Young's modulus of microstructural materials. Residual strain is indicated by a change in the differential capacitance change, whereas the Young's modulus is provided by the slope of a simple CV (capacitance vs. voltage) test. The device is suitable for automated wafer level as well as post-packaging readout. Typical strain sensitivities are 0.1-1 fF/MPa, and the CV slope essentially doubles (e.g. from 0.23 fF/V to 0.47 fF/V at 70 V bias) as the Young's modulus changes from 220 to 130 GPa. Nickel plated and polysilicon strain sensors were fabricated by surface micromachining techniques and coated with self-assembled monolayers using an ODS-based process. Both stress and Young's modulus measurements from these structures were found to closely match theoretical models.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
