Abstract
Microcapsule electrophoretic display (MED) is a kind of display with the properties of reflectivity and low power consumption. It is widely used in electronic book readers, but some new applications have appeared in the Internet of Things (IoT) products. Long working time is required in IoT products because it is not easy to replace or install such displays. The main failure phenomenon is the mura that will appear after about 1 to 2 years of use. The root cause of the failure is analyzed, and the lifetime prediction models for MED are introduced. The high temperature and high humidity (HTHH) test is used to evaluate the protective effect of the packaging structure. The HTHH test result is reported for the new MED structure; it shows that the MED with the new structure involves a longer working time.
Highlights
The LWW model is a newly develThere are three lifetime prediction models for this kind of failure mode: the Peck model, oped model andstructure is more suitable for predicting the lifetimethe of alifetime microcapsule electrophoThe package is the primary factor influencing of an Microcapsule electrophoretic display (MED)
The water transmission rate and the thermal contraction coefficient are very low for glass, so it is very suitable for MED protection
If the characteristics of this sealing glue can be improved, it will be possible to extend the lifetime of the MED panel
Summary
The microcapsule electrophoretic change if water invades the panel. TFT moisture barrier film, and sealing glue, thesealing cross-section of MED material is packaged using. TFT glass, moisture barrier and the crossthe addition ofglass, an electronic field to thefilm, material. The microc material is packaged using TFT glass, moisture barrier film, and section of PET. Thereisisno nomura muraeffect effectwhen when the thedisplays displayshave havejust justbeen beenmanufactured manufactured(Figure (Figure3) Even with this packaging, some defects appear after a long du defect is mura at the edge of the panel after about 1 to 2 years o application.
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