Abstract

A novel metamaterial rectifying surface (MRS) for electromagnetic energy capture and rectification with high harvesting efficiency is presented. It is fabricated on a three-layer printed circuit board, which comprises an array of periodic metamaterial particles in the shape of mirrored split rings, a metal ground, and integrated rectifiers employing Schottky diodes. Perfect impedance matching is engineered at two interfaces, i.e. one between free space and the surface, and the other between the metamaterial particles and the rectifiers, which are connected through optimally positioned vias. Therefore, the incident electromagnetic power is captured with almost no reflection by the metamaterial particles, then channeled maximally to the rectifiers, and finally converted to direct current efficiently. Moreover, the rectifiers are behind the metal ground, avoiding the disturbance of high power incident electromagnetic waves. Such a MRS working at 2.45 GHz is designed, manufactured and measured, achieving a harvesting efficiency up to 66.9% under an incident power density of 5 mW/cm2, compared with a simulated efficiency of 72.9%. This high harvesting efficiency makes the proposed MRS an effective receiving device in practical microwave power transmission applications.

Highlights

  • Just as with the rectenna, the overall efficiency of the metamaterial rectifying surface (MRS) is defined as the product of two efficiencies: the capture efficiency and the conversion efficiency.[7]

  • The former is the ratio of captured EM power to spatial EM power incident on the surface, and the latter is the ratio of direct current (DC) output power to captured EM power

  • Existing MRSs usually expose the diodes in high power EM incidence, so the diodes’ performance may be hindered

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Summary

Introduction

A metamaterial electromagnetic energy rectifying surface with high harvesting efficiency A metamaterial electromagnetic energy rectifying surface with high harvesting efficiency Xin Duan, Xing Chen,a and Lin Zhou College of Electronics and Information Engineering, Sichuan University, Chengdu 610064, China (Received 25 August 2016; accepted 29 November 2016; published online 15 December 2016)

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