Abstract
Integration of smaller, higher-functioning devices and use of advanced high thermal chip structures present thermal management challenges in the aerospace sector where reliability is the top priority and fail-safe processes/materials are the standard. As power density increases rapidly, traditional die attaching technology is becoming an increasingly limiting factor in microelectronics packaging for the next generation aerospace and defense systems. This paper introduces an advanced hybrid silver sintering technology, which incorporates ultra-high thermal and electrical performance of silver sintering with high reliability and process friendly of epoxy-based die attach technology. Unlike traditional silver sintering that requires high temperature and pressure, this hybrid sintering paste can be processed without applying any pressures in temperature ranges that are normal in microelectronics packaging processes. This paper presents results of an application study aimed at developing this unique technology in the field of high-power density devices for aerospace applications.
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