Abstract
A new versatile procedure employing low-angle ion milling and a self-clamping titanium grid to produce high-quality cross-sectional transmission electron microscopy (TEM) specimens for microelectronic packaging structures is proposed. Large electron transparent areas are generated with minimal mechanical damage, ion-induced damage, differential thinning in inhomogeneous materials, and surface roughness. An application example on gold thermosonic wire bonds is demonstrated.
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