A HIgh Current Density Low Cost Niobium 3 Tin Titanium Doped Conductor Utilizing A Novel Internal Tin Process

Abstract

An internal tin conductor has been developed using a Mono Element Internal Tin (MEIT) with an integral Nb barrier surrounding the Nb filaments. High current densities of 3000 A/mm2+ at 12 T and 1800 A/mm2 at 15 T have been achieved in conductors as small as 0.152 mm with the use of Nb7.5Ta filaments and Ti in the Sn core. In contrast, conductors with pure Nb and Ti in the Sn achieved 2700 A/mm2 at 12 T. Two internal fins, developed and patented on the project, were introduced into the filament array and reduced the effective filament diameter (Deff) by 38%. Additional fins will further reduce Deff The conductor was produced from 152.4 mm diameter billets to produce wire as small as 0.152 mm. The process promises be scaleable to 304 mm diameter billets yielding wire of 0.304 mm diameter. The MEIT process wire was easy to draw with relatively few breaks. The cost of this conductor in large production quantities based on the cost model presented could meet the 1.5 $/kilo amp meter(KAM) target of the HEP community