Abstract
AbstractTo achieve a planar multilevel interconnection, we have developed a process using an improved lift‐off pillar fabrication technique in conjunction with a new kind of heat resistant polymer, a copolyimide‐isoindoloquinazolinedione polymer (PIQ). As spin‐on dielectric layer, the PIQ polyimide is shown to satisfy both the processing criteria and interconnection criteria (high thermal resistance, good planarization properties and excellent dielectric properties).
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
