Abstract
Single-wafer rapid thermal processing (RTP) is widely used in semiconductor manufacturing. Achieving temperature uniformity on silicon wafer is a major challenge in RTP control. In this work, a lamp configuration including five concentric lamp zones is designed to obtain uniform temperature distribution on the wafer. An optics-based model is developed to determine the optimal lamp design parameters, and a uniformity criterion is proposed to evaluate the effective irradiance distribution of the tungsten–halogen lamps on the wafer. This method can be used to determine geometric parameters of the lamp array in order to achieve uniform temperature distribution on the wafer. A realistic simulation of a cold wall RTP system with five lamp rings and a 200-mm wafer is performed. The proposed model makes way for a simple method for determining the optimal lamp design parameters in RTP systems.
Highlights
The continuing downscaling of design features in ultra-large-scale integration (ULSI) is leading to manufacturing challenges in the semiconductor fabrication technology [1,2,3,4]
Rapid thermal processing (RTP) is used for various processes during the fabrication of semiconductor devices, such as rapid thermal annealing (RTA), rapid thermal oxidation (RTO), rapid thermal chemical vapor deposition (RTCVD) and rapid thermal nitration (RTN)
A lamp configuration design method isthe proposed for achieving temperature lamp ring, the lamp number on each lamp ring and the height of lamp array, so as to minimize the system
Summary
The continuing downscaling of design features in ultra-large-scale integration (ULSI) is leading to manufacturing challenges in the semiconductor fabrication technology [1,2,3,4]. Most of the existing RTP systems are designed without rigorous treatment of the light flux distributions of the heating sources and their impact on wafer temperature patterns is not considered. In these approaches, the design optimization cannot be achieved until the RTP system has been constructed and tested by temperature measurements. Electronics 2018, 7, 213 design method for heating sources (a tungsten–halogen lamp array) to achieve the temperature uniformity on wafer is desirable. Simulation results show that the design yields good temperature proposed model makes way for a simple method for determining the optimal lamp design uniformity on the wafer.
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