Abstract
Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the ...
Highlights
Solder is a fundamental material used in the assembly of electronic devices to printed circuit boards (PCBs)
The goal of constitutive modeling for solders in electronic packaging is to provide the precise information of stress, strain, and strain energy density for electronic reliability evaluation and design
The major constitutive models practiced in the literature have been reviewed and these could be categorized into two types: 1. Models without the definition of yield surface
Summary
Solder is a fundamental material used in the assembly of electronic devices to printed circuit boards (PCBs). Such a model provides a useful description of the steady creep rate as a function of temperature, but is seriously limited in applicability because the creep strain rate is an exponential function of stress rather than a power law function for high values of stress Creep behavior in this high stress region is expressed as follows where C1 and C2 are material constants. The difficulties of determining the parameters based on creep mechanism limit the application of the model
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