Abstract
A common framework of trap generation and trapping is used to explain Negative Bias Temperature Instability (NBTI) and Positive Bias Temperature Instability (PBTI) DC and AC stress/recovery data. NBTI is explained using trap generation in Si/SiON (IL) interface and SiON (IL) bulk, together with hole trapping in pre-existing bulk SiON (IL) traps. Interface trap generation and recovery can be fully explained using Reaction-Diffusion (RD) model. PBTI is explained using trap generation in SiON (IL)/HK interface and HK bulk, together with electron trapping in pre-existing bulk HK traps. Important similarities as well as differences between N and P BTI are highlighted.
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