Abstract
This paper describes a method to extract the relative complex dielectric permittivity from propagation coefficient measurements on microstrip lines. The material characteristics of microstrip lines fabricated on two different types of substrates commonly used in microwave circuit and printed circuit boards are investigated. The mechanisms that cause the effective permittivity of microstrip lines to be dispersive are explored. The technique includes creating closed-form effective permittivity equations to relate the effective permittivity of the microstrip lines to the real part of the dielectric permittivity of the substrate. Curve-fitting methods are used to create causal dielectric material models that relate the imaginary part of the dielectric permittivity to its real part. The methods developed in this paper can be used to characterize low-loss dielectric materials whose polarization is dominantly dipolar within the microwave frequency range in high-speed packaging applications.
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